HDI PCB Board Fabrication Capabilities

With the development of society, the progress of technology comes from people’s constant pursuit of life and their yearning for a higher quality of life. Personal consumer electronic products such as notebook computers, personal computers, and mobile phones require lighter weight and smaller volume, while smaller volume requires smaller design accuracy and higher density. At the same time, the quality and speed of interconnection technology should be better. This requires designers who make these products to design better components to improve electrical performance, such as circuit boards and so on.

In order to manufacture PCB products of this kind, PCB manufacturers need more advanced manufacturing technology. Of course, from the point of view of the product cost, it needs a lower cost. This seems contradictory, but HDI PCB can solve this problem very well. HDI PCB has numerous advantages, such as high speed, small size, and high frequency.

HDI StructuresType of Micro viasMass ProductionSmall-Middle BatchPrototypeAvailable
1+N+1Blind viasYesYesYes4 layers+
2+N+2Blind/BuriedYesYesYes6 layers+
staggered vias
2+N+2Blind/BuriedYesYesYes6 layers+
stacked vias
3+N+3Blind/Buried/YesYes8 layers+
staggered vias
3+N+3Blind/Buried//Yes8 layers+
stacked vias
1Quality GradeStandard IPC 2
2Number of   Layers4 – 24layers
3Order Quantity1pc – 10000+pcs
4Build Time2days – 5weeks
5MaterialFR4 standard Tg 140°C | FR4   High Tg 170°C | FR4 and Rogers combined lamination
6Board SizeMin 6*6mm | Max 457*610mm
7Board Thickness0.4mm – 3.0mm
8Copper Weight   (Finished)0.5oz – 2.0oz
9Min   Tracing/Spacing2.5mil/2.5mil
10Solder Mask   SidesAs per the file
11Solder Mask   ColorGreen | White | Blue |   Black | Red | Yellow
12Silkscreen   SidesAs per the file
13Silkscreen   ColorWhite | Black | Yellow
14Surface   FinishHASL – Hot Air Solder   Leveling
Lead Free HASL – RoHS
ENIG – Electroless Nickle/Immersion Gold – RoHS
Immersion Silver – RoHS
Immersion Tin – RoHS
OSP – Organic Solderability Preservatives –   RoHS
15Min Annular   Ring4mil, 3mil – laser drill
16Min Drilling   Hole Diameter6mil, 4mil – laser drill
17Max Exponents   of Blind/Buried Viasstacked vias for 3 layers   interconnected, staggered vias for 4 layers interconnected
18Other   TechniquesRigid-flex combination
Via In Pad
Buried Capacitor (only   for Prototype PCB total area ≤1m²)
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