Rigid-Flex PCB Fabrication Capability


1PCB Layers1 – 12 layers
2Laminate | MaterialFlexible part: DuPont PI, Shengyi PI
Rigid part: PI/FR4
FR4, for lead-free welding
low-loss material
Halogen free
Special materials: Rogers/Arlon/Nelco/Taconic etc
3Delivery SizeDelivery Size570X610mm570X610mm
Production size610X640mm610X640mm
4Board Thicknessthinnest0.25 mm0.20 mm
thickest5.00 mm5.50 mm
5Finished board thickness tolerance±2mil(±0.04m)
6Copper ThicknessInner Layer1/3-28 OZ1/3-30 OZ
Outer Layer1/7-28 OZ1/7-30 OZ
7Inner LineMinimum line width50μm50μm
Minimum line spacing75μm50μm
8Outer LineMinimum line width75μm50μm
Minimum line spacing75μm50μm
9Min. mechanical Via hole, minimum padinner Layer0.45 mm0.40 mm
Outer Layer0.40 mm0.35 mm
10Laser Via hole minimum padinner Layer0.25 mm0.23 mm
Outer Layer0.25 mm0.23 mm
11Thickness to diameter ratioLBMV1:11:1
12Min. dielectric thicknessInner core board0.025 mm0.025 mm
Prepreg0.05 mm0.05 mm
13Solder resistmin. spacing60 μm40 μm
Min. Solder resist bridge75 μm65 μm
14Buried capacitanceInsulation thickness: 14 μm
unit-area capacitance: 6.4 nF/in2
Breakdown voltage: >100V
15Buried resistorResistance per unit area(ohms/sq.) : 25, 50, 100, 200
16Impedance control accuracy10%5%
17Plug holeink plughole
resin plug holes
copper slurry plughole
18Min Tracing/Spacing2.5mil/2.5mil
19Min. Annular Ring4mil
20Min. Drilling Hole Diameter8mil(0.15mm)
21Min. mechanical drilling0.15 mm0.15 mm
22Laser aperture0.10-0.2 0mm0.10-0.20 mm
23Min. finished via diameter6mil(0.15mm)
24Tolerance of dimension3mil(0.076 mm)
25Solder Mask ColorGreen, White, Blue, Black, Red, Yellow
26Silkscreen ColorWhite, Black, Yellow
27Surface FinishOSP
HASL(Hot Air Solder Leveling)
HASL Lead-Free
Flash Gold
ENIG (Electroless Nickle/Immersion Gold)
Immersion Tin
Immersion Silver
28Special technologiesImpedance Control+/-10%
Gold fingers
Stiffener (PI/FR4)
Peelable solder mask
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