PCB Stack-up refers to the arrangement of copper layers and insulating layers that make up a PCB prior to board layout design. PCB stack up is am important part of the PCB design and manufacturing process.
As a professional PCB manufacturer, we have summarized the following PCB stacking design guidelines and precautions in practical applications, hoping to be helpful to most PCB designers.
PCB design is a complete and rigorous process system, and PCB manufacturing is another set of sophisticated production and processing systems.
HDI circuit board is an advanced printed circuit board. If you suspect you’ll need to work with component densities that require HDI layout and routing, here’s what you need to know about your next board and how to plan your design.
Printed circuit boards have become a fundamental factor in developing contemporary electronic products. Printed circuit boards are one of the core components of electronic products. According to different end products and usage scenarios, the PCB production process’s limitations and the PCB circuit boards’ design should also follow specific rules.
Through the Design For Manufacturability(DFM) of the printed circuit board, the design department and the production department can be effectively connected organically. The design, development, and production can be coordinated to unify the standards, realize production automation, and improve production efficiency.
This article will introduce in detail about what is PCB Design For Manufacturing (DFM) And Design For Assembly (DFA).
Five factors that FPC PCB designers should know about impedance control