This definitive guide covers all PCB drilling process fundamentals – understanding different hole types like plated through holes (PTHs), preparation steps for quality drilling, mechanical/laser drilling methods, addressing common quality issues, to inspection and improvements. Equip PCB designers, engineers and manufacturers with all the essential knowledge spanning drilling drawings, stack-up, parameters, tool selection to quality control procedures for optimized fabrication.
PCB Manufacturing Process
Via-in-pad technology for PCBs places vias directly within surface mount pads, conserving space by merging interconnect structures. Learn benefits and reliability factors in applying this innovation.
Filled and capped vias are advanced PCB design techniques that measurably enhance connection reliability. Learn when and why to leverage precision via filling and durable capping to prevent moisture ingress, fractures, and short circuits.
What are tented vias and why should PCB designers use them? Read our full guide covering how tented vias work, their benefits, ideal applications, and how to construct boards with quality via tenting.
Blind vias and buried vias enable improved signal routing, component density, performance, and simplified PCB stackups essential for complex, high-speed designs. This article explains what blind and buried vias are and key considerations for implementation.
Vias enable complex functionality in printed circuit boards by facilitating vertical transitions between layers. This article provides an overview of via roles, types, reliability factors, advanced structures, and the ongoing innovation driving PCB performance.
Explore the intricate journey of double-layer PCB manufacturing at JHYPCB, from routing to shipping. Witness the precision of processes like routing, V-cut, and QC, ensuring top-quality PCB fabrication.
We have now covered initial PCB production processes – substrate preparation, imaging, plating, etching to form circuitry. The board is now a semi-finished product. This section explains solder mask application to shield copper traces, silkscreen printing for informational markings and labels, and surface metal treatments to protect pads from oxidation while promoting soldering. With these enhancements, boards are fully ready for electronics assembly.
We have covered initial PCB production steps – milling, foil lamination, drilling. Now we detail processes to transform base material into functional printed circuit board. First, copper electroplating deposits into drilled holes and grows copper thickness. Photolithography uses UV light to transfer layout pattern onto copper layer. Exposed copper gets etched away, leaving only desired conductive traces. Finally, automated optical inspection compares board to original design to validate quality.
In our PCB manufacturing process deep dive, we explored lamination, exposure, and development steps that transfer circuit layouts onto boards. Up next, we tackle graphical electrodeposition and AOI.
Dive into the world of PCB manufacturing with our comprehensive guide, focusing on three crucial stages: Manufacturing Instruction (MI), Material Cutting, and Drilling. Join us on a journey through precision and innovation at JHYPCB, where every step in the process plays a vital role in creating high-quality printed circuit boards.
One of the unique processes of the flexible printed board manufacturing process is the processing of the cover layer. The processing methods of the cover layer can be divided into three categories: cover film, screen printing, and photo coated layer.
An aluminum PCB is a printed circuit board that contains a thin layer of conductive dielectric material. Aluminum PCB is widely used in the LED lighting industry. Here we will explain the manufacturing process and process of aluminum PCB in detail.
Rigid-flex PCB is a printed circuit board that combines the features and advantages of flexible PCB and rigid PCB. It combines rigid PCB and flexible PCB through a lamination process.