Hot Air Solder Leveling, abbreviated as HASL, is one of the surface finish processes of printed circuit boards. Hot Air Solder Leveling is also the most popular type of PCB surface finish.
The popularity of immersion gold surface finish has grown over the years. Today, it is the trendiest idea amongst others in the industry.
OSP refers to Organic Solderability Preservative. It is the leading PCB surface finishing coating option used by the PCB industry for protecting Copper surfaces and its features that are exposed from oxidation before the PCB is populated.
Gold has a commendable resistance to corrosion and oxidation. If a PCB has a surface finish of gold, it will last for a long time, and the copper underneath the surface finish will remain intact and sound.