PCB Manufacturing Capabilities

The continuous upgrading of the process manufacturing capacity is our most competitive advantage. The upgrading of manufacturing capacity also means providing customers with the most advanced production technologies and reducing costs for customers.

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technical Capabilities

Full Technical Capabilities of Our All Types of PCB Manufacturing and SMT Assembly Services

Rigid Printed Circuit Boards
Flexible PCB Circuit Board
  • Layers: 1-10
  • MOQ: 1 pcs
  • Laminate: Dupont PI, Shengyi PI
  • Minimum Hole Size: 0.1mm
  • Thickness: 0.05mm+/-0.02mm
  • Max Size: 480*4000mm
  • Panelization Size: 250*510mm
  • Lead Time: 24 Hours – 9WD
  • Solder Mask Color: Green, White, Blue, Black, Red, Yellow, etc.
Rigid Printed Circuit Boards
  • Layers: 1-12
  • Laminate: Dupont PI, Halogen Free
  • Thickness: 0.20 – 5.50 mm
  • Max Size: 610X640mm
  • Impedance Control: +/-10%
  • Surface Finish: HASL(LF), ENIG, Immersion Tin/Silver
  • Solder Mask Color: Green, White, Blue, Black, Red, Yellow, etc.
High Density Interconnector PCB Circuit Board
  • Layers: 4-24 layer
  • MOQ: 1 pcs
  • HDI Structures: 1+N+1, 2+N+2, 3+N+3
  • Quality Grade: Standard IPC 2
  • Build Time: 2 days – 5 weeks
  • Material: FR4 standard Tg 140°C | FR4 High Tg 170°C, etc.
  • Board Size: Min 6*6mm | Max 457*610mm
  • Board Thickness: 0.4mm – 3.0mm
PCB SMT Stencil Manufacturing
  • Technology: 100% laser cut
  • Types: Framed, Frameless, Electroformed, Nano Coating
  • Material Used: Stainless Steel
  • Stencil Thickness: 0.06 ~ 0.3 mm
  • Minimum Cut Width: 0.05 mm
  • Maximum Size: 736 X736 mm
  • Aperture Tolerance: within 0.007mm
  • Allow for Fiducial Data: Yes
  • Allow for Panelized Data: Yes
  • Delivery: 1 ~2 Day
PCB Assembly Services
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