Custom Rigid-Flex PCB Fabrication
Rigid-Flex PCB Manufacturing & Prototype Services
Custom rigid-flex PCB fabrication for engineering prototypes, design revisions and production orders. Bring your stackup, material specifications and mechanical requirements together for construction-specific manufacturing review.
- Prototypes & Production
- Stackup & DFM Review
- Custom Construction Requirements
Key Fabrication Specifications
Rigid-Flex PCB Capabilities at a Glance
Start with the core ranges below, then review the detailed capabilities for regional process limits and construction-specific conditions.
2–32
Total Conductive Layers
Rigid-flex construction range. Confirm the complete stackup and the layer structure in each region.
1–12
Flexible Layers
Flexible-layer range within the proposed construction. Total and flexible layer counts must be specified separately.
4 / 4 mil
Flex-Region Trace / Space
At 0.5 oz copper. This is not a universal rule for every copper weight, region or stackup.
±10% / ±7%
Controlled Impedance
±10% for mass production; ±7% for prototype or extended review, subject to the specified stackup and test requirements.
Capability limits depend on materials, copper weight, regional geometry, via structure and process combination. Individual limits are not automatically available together.
View Detailed Rigid-Flex Capabilities →Define the Board Region by Region
Rigid-Flex Construction & Stackup Options
A rigid-flex stackup needs more than a single layer-count label. Identify the rigid and flexible regions, the layers present in each region and how the electrical connections pass through the construction.
Rigid Regions
Define each rigid area's outline, layer construction and finished thickness. Identify plated connections, controlled impedance requirements and any local thickness or dimensional constraints.
Flexible Interconnect Regions
Show which conductive layers continue through the flexible section. Include flex outlines, copper requirements, coverlay details and the intended bend locations or installed configuration.
Advanced Features & Local Structures
Identify blind or buried connections, HDI features, air-gap requirements and other special structures explicitly. Their suitability must be reviewed against the complete material and stackup system.
Connect the Electrical & Mechanical Requirements
Materials, Flex Areas & Transition Requirements
Describe the material system and intended mechanical configuration together. The fabrication package should identify where the board remains rigid, where it bends and which local construction details must be maintained.
01 / Material System
Specify the Complete Material Build
Include the requirements for both rigid and flexible regions rather than specifying only “PI + FR-4.” Identify approved grades and whether alternatives may be proposed.
- Polyimide and FR-4 material designations
- Copper thickness and copper type where specified
- Core, prepreg, adhesive and coverlay requirements
- Finished thickness by region and permitted substitutions
Review PCB material options when preparing the proposed construction.
02 / Flexible Regions
Describe How the Flex Section Will Be Used
Show the intended installed shape and identify whether bending occurs during installation or repeatedly during operation. Include the relevant mechanical requirements for review.
- Flex outlines and bend locations
- Required bend direction, radius or angle
- Installation-only or repeated-flexing use
- Clearance, movement and environmental requirements
Use drawings or supporting mechanical information to explain the required configuration rather than relying on a product photograph alone.
03 / Local Construction
Define Transitions & Reinforcement
Identify the rigid-to-flex boundaries and any local features that affect the mechanical fit. State where coverlay, reinforcement or exposed contact areas are required.
- Rigid-to-flex boundaries and transition geometry
- Coverlay openings and exposed copper areas
- Stiffener location, material and thickness
- Local thickness limits and dimensional requirements
Comparing construction approaches? Read flex with stiffener vs. rigid-flex PCB .
Engineering Samples to Pilot Builds
Rigid-Flex PCB Prototype Services
Plan your rigid-flex prototype around the electrical design, intended mechanical configuration and evaluation requirements. Keep the fabrication specification clear as the project moves through revisions and pilot quantities.
- 01 →
Initial Engineering Prototypes
Submit the stackup, rigid and flexible region drawings, materials and intended installed shape. Identify the critical features your team needs to evaluate before approving the first fabrication order.
Prepare: fabrication files, mechanical requirements, quantity and acceptance criteria.
- 02 →
Revised Prototypes
Clearly identify changes made after evaluation. Update the fabrication files and supporting drawings together, including any changes to flex geometry, materials, coverlay or reinforcement.
Confirm: the new revision, changed features and specifications that remain unchanged.
- 03
Pilot Runs & Production Transfer
Confirm the approved construction and intended quantity for the next order. Recheck any prototype-specific approvals, panel requirements, verification records and delivery arrangements.
Next stage: low-volume PCB fabrication for pilot and repeat small-batch requirements.
Prototype fabrication does not by itself establish bend-life or application qualification. Include any required mechanical evaluation, reliability testing or supporting documentation for project-specific confirmation.
Resolve Manufacturing Questions Before Release
Rigid-Flex DFM & Manufacturing Review
Design for manufacturability review connects your fabrication data with the proposed construction. Identify critical features and resolve open requirements before the board is released for fabrication.
Region Identification & Stackup
Check that the rigid and flexible region drawings, layer assignments and thickness requirements describe the same construction as the fabrication data.
Materials, Copper & Regional Trace Rules
Review laminate designations, copper references and trace requirements by region. Keep rigid-area and flex-area limits separate, including any copper-dependent spacing conditions.
Drilling, Pads & Interconnections
Identify finished hole requirements, via layer spans and pad geometry. Flag blind, buried or laser-drilled features and any special filling or backdrilling requirements.
Coverlay, Reinforcement & Profile
Confirm coverlay openings, stiffener details and the finished outline. Identify local thickness requirements and any critical fit dimensions in the supporting drawings.
Bend Areas & Rigid-to-Flex Transitions
Review the indicated bend locations and transition geometry against the intended mechanical configuration. Include installation or repeated-flexing requirements rather than leaving the use condition unspecified.
Impedance, Tolerances & Acceptance
Define the applicable impedance targets, dimensional tolerances and verification requirements. Identify customer-specific criteria and specifications that must not be changed without approval.
Send the Construction Details with Your Files
Include the stackup, region drawing and special requirements with the fabrication package. See our pre-production engineering information and rigid-flex fabrication capabilities when preparing the request.
Manufacturing review addresses fabrication requirements. Application qualification, bend-life validation and other project-specific testing should be defined separately. Any proposed construction changes require confirmation before production release.
From Approved Construction to Delivery Requirements
Rigid-Flex Fabrication & Quality Verification
The fabrication route follows the approved rigid-flex construction. Define the critical features, inspection requirements and delivery records alongside the manufacturing specification.
-
Process Focus 01
Materials & Circuit Layers
Prepare the specified material system and circuit layers with the required copper construction and region-specific features.
-
Process Focus 02
Stackup & Interconnections
Build the approved construction with the required lamination, drilling and interconnection processes for the specified layer structure.
-
Process Focus 03
Protection & Surface Finish
Apply the required coverlay, solder mask, surface finish and reinforcement features according to the fabrication drawings.
-
Process Focus 04
Profile, Verification & Packing
Complete the finished outline and agreed verification, then prepare the boards and specified records for the confirmed delivery format.
These are process groups, not a fixed operation sequence. The detailed route and repeated operations depend on the stackup, materials and interconnect structure.
Define What Must Be Verified
Translate critical design requirements into clear acceptance criteria. Keep electrical continuity, impedance verification and application-specific reliability requirements distinct.
- Visual & dimensional: identify critical outlines, hole sizes, local thicknesses and region boundaries.
- Electrical requirements: confirm the required continuity and isolation test scope against the fabrication specification.
- Controlled impedance: specify targets, tolerances, relevant layers and requested verification records.
- Supporting records: identify any requested microsection, material, plating or inspection documentation.
- Special reliability requirements: define any required bend, thermal or other project-specific evaluation separately.
Requested verification methods, report availability, acceptance criteria and any associated cost or lead time should be confirmed for the order. Not every record or reliability evaluation is automatically included.
Define the Construction Before Comparing Quotes
What Affects Rigid-Flex PCB Cost & Lead Time?
Pricing and scheduling depend on the complete rigid-flex construction, not simply the total layer count. Provide the same specifications when comparing quotations or discussing manufacturing alternatives.
Swipe horizontally to view all columns.
| Factor | What Needs to Be Assessed | What to Specify |
|---|---|---|
| Rigid & Flexible Layer Construction | Total layers, flexible layers and the local construction in each region define the proposed stackup. | Region-specific layer assignments, finished thicknesses and the complete stackup drawing. |
| Materials & Copper | The material system, copper requirements and availability need confirmation for the intended process route. | Laminate grades, copper references, coverlay, adhesives and permitted material substitutions. |
| Interconnections & Special Processes | Blind or buried vias, HDI features, filling and other special structures require construction-specific review. | Via layer spans, drill requirements, filling conditions and special process notes. |
| Outline, Panel Format & Reinforcement | Board geometry, panel arrangement and local reinforcement requirements form part of the manufacturing scope. | Finished outline, delivery format, stiffener locations and critical mechanical dimensions. |
| Finish, Tolerances & Verification | Plating, impedance, dimensional acceptance and requested records must be included in the quoted requirements. | Surface finish, plating thickness, tolerances, test criteria and documentation needs. |
| Quantity, File Readiness & Target Date | The intended quantity, unresolved engineering questions and requested deadline must be reviewed together. | Order quantity, approved revision and required ship date or arrival date, clearly identified. |
Discuss the Required Date with the Full Specification
For time-sensitive prototypes, submit the complete construction and identify any limit-level features. Review our rigid-flex fabrication capabilities before assuming a particular manufacturing schedule.
Confirm fabrication timing and transit arrangements separately. A requested deadline is not an approved delivery commitment until the order requirements and schedule have been agreed.
Prepare a Consistent Fabrication Package
Files Required for a Rigid-Flex PCB Quote
Submit the manufacturing data and supporting requirements together. The files should explain both the electrical construction and the intended mechanical configuration.
Files, Regions & Revision
- Gerber files and matching drill data
- Finished outline and fabrication drawing
- Rigid and flexible region identification
- Part number, revision and changes from earlier builds
Stackup & Mechanical Requirements
- Total layers and flexible layers by region
- Materials, copper and finished thickness requirements
- Coverlay, stiffeners and local construction details
- Installed configuration, bend locations and use conditions
Quantity, Acceptance & Delivery
- Quantity and individual-board or panel delivery
- Surface finish, impedance and special tolerances
- Required verification and supporting records
- Requested ship date or arrival date
From File Submission to Fabrication Approval
-
Step 01 / Submit
Send the Project Package
Provide the files, drawings and order requirements. Flag unresolved items and specifications that must not be changed without approval.
-
Step 02 / Confirm
Resolve Specifications & Quote
Clarify engineering questions and confirm the proposed construction, pricing and schedule. Review any alternatives before accepting them.
-
Step 03 / Approve
Release the Approved Revision
Confirm the final fabrication package, order details and delivery arrangements before the order is released for production.
Keep filenames, drawings and written specifications aligned to the same revision. Clearly identify changes submitted after quotation or approval so their effect on the order can be reviewed.














Common Project & Manufacturing Questions
Rigid-Flex PCB FAQ
Answers to common questions about construction, prototype preparation, manufacturing review and quotation.
When should I choose a rigid-flex PCB instead of separate boards and cables?
Consider rigid-flex when your design needs rigid circuit regions connected through flexible sections within a defined mechanical configuration. Compare the proposed construction with separate boards, cables or a flexible circuit with stiffeners. The choice should account for electrical requirements, installation, movement, manufacturing complexity and the overall product design.
How should total layers and flexible layers be specified?
Provide a region-specific stackup showing the conductive layers present in each rigid and flexible region. State the total layer construction and flexible layer count separately. A label such as “4-layer rigid-flex” is not sufficient without the corresponding stackup and region drawing. See our construction and stackup guidance for the information to include.
What information is needed for a rigid-flex prototype quote?
Submit Gerber and drill data with the fabrication drawing, region identification, stackup and material requirements. Include copper and thickness specifications, coverlay or reinforcement details, intended mechanical configuration, quantity and target date. Use the rigid-flex quotation checklist to prepare a consistent project package.
Can you support revised prototypes and pilot runs?
Yes. Identify the approved revision, changes from earlier builds and the quantity required for the next order. Reconfirm any prototype-specific process approvals, acceptance criteria and documentation needs. Our rigid-flex PCB prototype services section explains the progression from initial samples to revised builds and pilot quantities.
How are bending and rigid-to-flex transition requirements reviewed?
Include bend locations, the intended installed shape, required radius or angle and whether bending occurs during installation or repeatedly during operation. These requirements are reviewed with the materials, copper construction, coverlay and transition geometry. Any required bend-life or reliability validation should be specified separately.
What affects rigid-flex PCB pricing and lead time?
The quotation depends on the complete construction: regional layer counts, materials, interconnections, board geometry, reinforcement, finish, quantity and verification requirements. File readiness and the requested date also need consideration. Review the cost and lead-time factors and submit the full specification for confirmation.
Where can I find detailed rigid-flex fabrication capabilities?
Visit our rigid-flex PCB fabrication capabilities page for detailed parameters and applicable conditions. Read each value with its region, material, copper and process requirements; individual limits are not automatically available in the same construction.

Bring Your Construction into Review
Ready to Discuss Your Rigid-Flex PCB Project?
Send your fabrication files, stackup and mechanical requirements with the intended quantity and target date. Identify critical features so the proposed construction can be reviewed for quotation.
Final construction, approved specifications, pricing and delivery arrangements are confirmed for the proposed order.
Related Technical Guides
Rigid-Flex PCB Design & Manufacturing Guides
Explore stackup planning, construction comparisons and manufacturing topics as you prepare the requirements for your project.
Stackup Planning
Rigid-Flex PCB Stackup
Read the stackup guide alongside your proposed rigid and flexible region drawings.
Read the Stackup Guide →Construction Selection
Flex with Stiffener vs. Rigid-Flex PCB
Explore the comparison when considering which construction to discuss for your design.
Compare the Constructions →Fabrication Process
Rigid-Flex PCB Manufacturing Process
Continue with the manufacturing process article for additional fabrication background.
Explore the Manufacturing Process →