Custom High-Density Interconnect PCB Fabrication
HDI PCB Manufacturing & Prototype Services
Custom HDI PCB fabrication for engineering prototypes, revised designs and production orders. Discuss your build-up structure, microvia configuration and material requirements with a manufacturing-focused engineering review.
- Prototypes & Production
- Build-Up & Microvia Review
- Quality Documentation
Structures, Engineering & Verification
HDI PCB Manufacturing at a Glance
Review the service scope below, then check the detailed capability matrix and project requirements for your proposed HDI construction.
Build-Up Structures
1+N+1 to 3+N+3
Listed configurations cover prototype, small / medium batch and volume production categories, subject to the proposed construction.
Microvia Options
Stacked & Staggered
Define the required layer connections, microvia arrangement, copper filling and pad requirements with your stackup and via map.
Advanced Project Review
Higher-Order & Any-Layer
Submit 4th- to 7th-order HDI and Any-Layer requirements for construction-specific review and production-stage confirmation.
Quality Support
Reports & Verification
- Microsection reports with every order
- 100% impedance testing
- IPC Class 3 requirements supported
Match the Interconnect to the Construction
HDI Build-Up Structures & Via Options
Use the required layer connections and routing constraints to define the proposed HDI structure. A build-up label alone does not describe every material, microvia or manufacturing requirement.
Total conductive layers, HDI build-up order and lamination cycles are different descriptions. Confirm their meaning within the proposed construction rather than treating them as interchangeable counts.
Engineering Samples, Revisions & Pilot Builds
HDI PCB Prototype Services
Prepare your HDI prototype around a defined stackup, via configuration and evaluation goal. Keep those requirements consistent as the design progresses through revisions and the next manufacturing stage.
Start with a Defined Construction
Provide more than a total layer count or a general “HDI” designation. Identify the interconnect structure and critical features that need manufacturing review.
- Proposed stackup and material requirements
- Via map with start and end layers
- Stacked or staggered microvia configuration
- Filling, impedance and acceptance requirements
Use the HDI manufacturing capabilities to identify relevant structure options and project-specific review conditions.
Initial Engineering Prototypes
Submit the fabrication package with the quantity and features your team needs to evaluate. Confirm the proposed construction and resolve open requirements before fabrication approval.
Revised Prototypes
Identify changes made after evaluation and update the fabrication files, stackup and via definitions together. State which previously approved specifications remain unchanged.
Pilot Runs & Repeat Small Batches
Confirm the approved revision, intended quantity, panel requirements and verification scope. Recheck prototype-specific approvals when moving to low-volume PCB fabrication .
Connect the Design Data with the Manufacturing Requirements
Materials, Stackup & HDI DFM Review
Design for manufacturability review assesses the proposed materials, layer construction and interconnect requirements together. Provide the details below so open questions can be resolved before fabrication release.
Materials, Dielectrics & Copper
Define the material grades, dielectric thicknesses and copper requirements for the proposed construction. Clearly distinguish base copper from finished copper specifications.
Include: material designations, layer-specific requirements and any permitted substitutions. Review the PCB material options where relevant.
Build-Up & Via Layer Spans
Show each required connection in the via map. Identify blind, buried and through connections, together with stacked or staggered microvia arrangements.
Include: the complete stackup, via start and end layers, and the intended HDI structure.
Hole Geometry, Pads & Registration
Identify whether a hole dimension refers to a drill size or a finished opening. Provide the associated depth, pad geometry and critical alignment requirements for review.
Include: hole definitions, capture and landing pads, and any special positional tolerances.
Via-in-Pad, Filling & Capping
Specify the intended treatment of each relevant via type. Do not use resin plugging, copper filling and capping as interchangeable descriptions.
Include: affected via locations, required fill process, finished surface condition and acceptance criteria.
Routing & Controlled Impedance
Identify critical trace and spacing requirements with the applicable copper thickness. Define impedance targets and tolerances for the relevant layers or nets.
Include: routing constraints, impedance requirements and the proposed reference-layer arrangement.
Acceptance, Records & Revision Control
Keep the fabrication files, drawings and written requirements aligned. Flag critical acceptance criteria and any specification that must not be changed without approval.
Include: the approved revision, applicable standards, requested records and changes from earlier builds.
Submit the Full Construction for Review
Compare the HDI fabrication capabilities with your project requirements, then send the files and supporting specifications. See our pre-production engineering information for the manufacturing review context.
A manufacturing review addresses the proposed fabrication requirements. Any construction changes, test requirements and customer-specific acceptance conditions must be confirmed before production release.
Verification, Records & Acceptance
HDI Quality Verification & Documentation
Connect the fabrication specification with defined verification requirements. Our HDI quality support includes microsection reports with every order, 100% impedance testing and support for IPC Class 3 requirements.
Define the Required Evidence
Make Acceptance Requirements Clear Before Fabrication
Identify what must be verified and documented for the proposed board. Keep electrical continuity, impedance verification and structural inspection distinct in the order requirements.
Include customer-specific reporting formats, acceptance limits and any additional reliability evaluation when requesting a quote.
Microsection Reports with Every Order
A microsection report is included with every HDI PCB order. Identify any customer-specific reporting, sampling or acceptance requirements so they can be incorporated into the agreed scope.
100% Impedance Testing
We provide 100% impedance testing. Specify target values, tolerances and the applicable layers or nets so the required test scope and reporting are clearly defined.
IPC Class 3 Support
We support HDI fabrication to IPC Class 3 requirements. State the applicable standard, revision and any additional customer criteria before the order is released for production.
Include These Verification Details with the RFQ
- Critical dimensions and finished-hole acceptance requirements
- Electrical test requirements and impedance targets
- Applicable IPC standard, revision and acceptance class
- Requested report format and additional reliability evaluation
Additional test methods, customer-specific records and application qualification requirements should be confirmed separately. IPC Class 3 support describes manufacturing and acceptance requirements, not a separate certification claim.
Selected Product Construction Examples
Representative HDI Board Constructions
These examples illustrate the range of HDI constructions represented in our product information. Use them as a starting point for discussion, not as a substitute for your project's complete fabrication specification.
Multilayer HDI Example
10-Layer, 2nd-Order HDI PCB
- Total Layer Count
- 10 conductive layers
- Product Designation
- 2nd-order HDI
This example identifies both the total layer count and the HDI order. Provide the actual build-up arrangement and layer connections when requesting a comparable construction.
Confirm for your project Stackup, via configuration, materials, copper requirements and production quantity.
Higher-Order HDI Example
4th-Order HDI with Blind & Buried Vias
- Product Designation
- 4th-order HDI
- Listed Interconnection Features
- Blind and buried vias
Submit higher-order requirements with a complete via map and stackup. The product designation does not by itself specify the total layer count or the detailed process sequence.
Confirm for your project Via layer spans, microvia arrangement, filling conditions and applicable production stage.
Advanced Interconnect Example
7th-Order Any-Layer HDI PCB
- Product Designation
- 7th-order HDI
- Listed Interconnection Type
- Any-Layer
Review Any-Layer requirements against the intended layer-to-layer connections and material system. The example does not define universal limits for every advanced HDI design.
Confirm for your project Complete interconnect map, geometry, copper filling, verification requirements and intended quantity.
Planning a construction beyond the listed structure matrix? Compare the advanced review requirements before submitting your proposed stackup and via map.
Review Advanced HDI RequirementsRepresentative product information does not establish a single combined process window, availability at every production volume, or a fixed price and lead time. Final requirements are confirmed for the proposed order.
Define the Scope Before Comparing Quotes
What Affects HDI PCB Cost & Lead Time?
An HDI quotation needs the complete construction, not just the board size and total layer count. Provide the specifications below so price and schedule can be assessed against the same requirements.
Swipe horizontally to view all columns.
| Factor | What Needs to Be Assessed | What to Specify |
|---|---|---|
| Build-Up & Layer Construction | Total layers, build-up arrangement and interconnect requirements define the proposed manufacturing route. | Complete stackup, intended HDI structure and required layer-to-layer connections. |
| Microvias & Filling | Via geometry, stacked or staggered arrangements, filling and capping requirements form part of the process scope. | Via map, hole dimensions, dielectric depths, pad requirements and specified fill conditions. |
| Materials & Copper | The laminate system, dielectric construction, copper requirements and material availability need confirmation. | Material grades, layer-specific copper specifications and permitted alternatives. |
| Fine Features, Dimensions & Finish | Trace spacing, critical tolerances, finished geometry and surface treatment must be reviewed as a combined specification. | Minimum features, board and panel dimensions, special tolerances and surface finish. |
| Verification & Acceptance | The agreed inspection, testing and reporting scope needs to reflect the intended acceptance requirements. | Impedance targets, applicable standards, customer-specific records and additional reliability requirements. |
| Quantity, Files & Required Date | Intended quantity, unresolved engineering details and the requested deadline must be considered together. | Order quantity, consistent fabrication revision and required ship date or arrival date. |
Have a Target Date or a Construction to Compare?
Submit the complete requirements and identify any specifications that must remain unchanged. Review our HDI manufacturing capabilities before assuming that different constructions can follow the same process or schedule.
Confirm fabrication timing and transit arrangements separately. Any proposed changes to materials, stackup or specifications require approval before they are incorporated into the order.
Prepare a Consistent Manufacturing Package
Files Required for an HDI PCB Quote
Send the fabrication data, proposed construction and order requirements together. Clearly identify any unresolved items so they can be addressed during engineering and quotation review.
Files, Drawings & Revision
- Gerber files and matching drill data
- Finished board outline and fabrication drawing
- Part number and fabrication revision
- Clearly identified changes from earlier builds
Stackup, Materials & Via Map
- Proposed stackup and finished board thickness
- Material grades and layer-specific copper requirements
- Via start and end layers with stacked or staggered definitions
- Microvia dimensions, filling, capping and via-in-pad requirements
Quantity, Acceptance & Delivery
- Quantity and individual-board or panel delivery
- Surface finish, impedance targets and special tolerances
- Applicable acceptance standards and requested records
- Required ship date or arrival date
From File Submission to Fabrication Approval
-
Step 01 / Submit
Send the Project Package
Provide the files, stackup, via map and order requirements. Flag critical specifications that must not be changed without approval.
-
Step 02 / Confirm
Resolve Construction & Quote
Clarify open engineering questions and review the proposed construction, pricing and schedule. Confirm any alternatives before accepting them.
-
Step 03 / Approve
Release the Approved Revision
Confirm the final fabrication package, acceptance requirements and delivery arrangements before production release.
Keep the files, drawings and written requirements aligned to the same revision. Identify dimensions as drill sizes or finished sizes where applicable, and specify the scope of impedance and acceptance requirements.
Before You Submit Your Project
HDI PCB Service FAQ
Answers to common questions about HDI structure selection, prototype orders, verification and quotation.
When should I consider HDI instead of a conventional multilayer PCB?
Consider an HDI review when the proposed board has demanding routing, interconnect or size requirements. Submit the component and routing constraints with the stackup so the need for microvias or additional build-up structures can be assessed. Do not assume that a more complex HDI construction is automatically the best choice.
How is an appropriate HDI build-up selected?
Define the required layer connections, routing constraints, materials and acceptance requirements. Review these together with the via map and proposed stackup. Our HDI structure overview explains the information needed to discuss standard build-up and advanced interconnect options.
Can you support HDI prototypes and revised builds?
Yes. Submit the fabrication package, required quantity and evaluation requirements for the proposed prototype. For revised builds, identify the changes and update the stackup, via definitions and drawings consistently. See our HDI PCB prototype services for the progression from initial samples to revisions and pilot quantities.
Can higher-order and Any-Layer requirements be reviewed?
Yes. We review higher-order HDI requirements, including 4th- to 7th-order builds and Any-Layer interconnect projects. Submit the actual stackup, via map, materials and intended quantity. Construction and production-stage suitability must be confirmed for the project. Review the advanced HDI requirements before submitting.
What affects HDI PCB pricing and lead time?
The quotation depends on the complete construction, including build-up arrangement, microvias, materials, filling, finish, quantity and verification requirements. File readiness and the requested date also need consideration. Review the cost and lead-time factors and identify whether your deadline refers to shipment or arrival.
What quality documentation and verification do you provide?
Microsection reports are included with every HDI order, and we provide 100% impedance testing. We also support IPC Class 3 requirements. Specify impedance targets, applicable layers or nets, the required IPC standard and revision, and any customer-specific reporting criteria. Additional verification requirements should be confirmed with the quotation.
What information is needed to request an HDI PCB quote?
Provide fabrication and drill data, the proposed stackup, via map, material and copper specifications, quantity and target date. Include filling, impedance, finish and acceptance requirements where applicable. Use the HDI quotation checklist to prepare a consistent project package.
Bring Your HDI Construction into Review
Ready to Discuss Your HDI PCB Project?
Send your fabrication files, proposed stackup and via map with the quantity and target date. Highlight critical features, impedance requirements and acceptance criteria for a construction-specific quotation.
Final construction, approved specifications, pricing and delivery arrangements are confirmed for the proposed order.