Custom Flex Circuit Fabrication in China
Flexible PCB Manufacturing
Custom single-layer, double-sided and multilayer flexible PCBs for prototype and production orders. PCBELEC manufactures flex circuits with specified materials, coverlay, stiffeners and connection features for your product’s installation and movement requirements.
Send your fabrication package to sales@pcbelec.com
- Circuit Structures Single, Double & Multilayer
- Fabrication Features Coverlay, Stiffeners & Contacts
- Order Stages Prototypes to Production
Flexible Printed Circuits / FPC
Flexible Circuits Built for Your Product
A flexible PCB, also called a flex circuit or FPC, uses copper circuitry on a thin flexible dielectric, commonly polyimide. It provides electrical connections within a structure that can be shaped around the product’s mechanical layout.
PCBELEC manufactures flexible bare boards with defined circuit layers, coverlay openings, stiffeners and contact features. Specify the flexible regions and connection interfaces alongside the electrical design.
Start with the use condition: a circuit bent into position during installation and a circuit that moves repeatedly in operation have different mechanical demands.
Define the Functional Regions
Fit the Installation
Identify the installed shape, available space, connection positions and the regions that bend during installation.
Define the Movement
For moving circuits, describe the bend location, radius, motion and expected operating cycles in the project requirements.
Support the Interfaces
Define local stiffeners, contact thicknesses, coverlay openings and attachment areas for the specified interfaces.
Pair the circuit data with a mechanical drawing that identifies flexible regions and connection requirements.
Manufacturing File Requirements →Select the Circuit Structure
Choose Your Flex Circuit Construction
Start with the routing, connection and movement requirements. Single-layer, double-sided and multilayer flex circuits offer different ways to organize the copper and interconnections.
One Conductive Layer
Copper shown in brown; dielectric in amber.
Single-Layer Flex PCB
One copper circuit layer on a flexible dielectric. A direct construction for interconnects whose routing fits on one conductive layer.
- One conductive routing layer
- Defined coverlay and contact openings
- Local stiffeners at specified interfaces
Two Conductive Layers
Schematic layers; plated interconnections omitted.
Double-Sided Flex PCB
Copper circuits on both sides of a flexible dielectric, with plated-through connections between designated top and bottom features.
- Top and bottom circuit routing
- Plated-through layer connections
- Coverlay and contact features on both sides
Three or More Conductive Layers
Four-layer example; not a complete build drawing.
Multilayer Flex PCB
Three or more conductive layers in a laminated flexible construction, providing additional routing and reference-layer options.
- Defined layer stackup and interconnections
- Additional signal or reference layers
- Region-specific construction and thickness
Identify the required circuit structure, then define the flexible-region stackup, materials and mechanical conditions.
View Flex PCB Fabrication Capabilities →Flexible Circuit Fabrication Specifications
Flexible PCB Manufacturing Capabilities
PCBELEC manufactures single-sided, double-sided and multilayer flex circuits with polyimide materials, defined routing and interconnects, coverlay protection and local reinforcement.
- Circuit Layers 1–16 Layers
- Base Materials DuPont PI / Shengyi PI
- Maximum Single-Sided Size 480 × 4000 mm
Swipe horizontally to view all fabrication specifications.
| Capability Item | Construction / Category | Manufacturing Specification |
|---|---|---|
| Circuit Layers | Single-sided, double-sided and multilayer flex | 1–16 layers |
| Base Materials | Polyimide laminate systems | DuPont PI / Shengyi PI |
| Maximum Board Size | Single-sided flex | 480 × 4000 mm |
| Maximum Board Size | Double-sided flex | 480 × 1800 mm |
| Maximum Board Size | Multilayer flex | 236 × 600 mm |
| Minimum Board Thickness | Single-sided flex | 0.05 mm ±0.02 mm |
| Minimum Board Thickness | Double-sided flex | 0.08 mm ±0.02 mm |
| Finished Board Thickness | 1–6 layer flex constructions | 0.05–0.6 mm |
| Minimum Trace / Space | 1/3 oz or 1/2 oz copper; 1–6 layers | 0.076 / 0.076 mm |
| Minimum Trace / Space | 1 oz copper; 1–6 layers | 0.10 / 0.10 mm |
| Minimum CNC-Drilled Hole | 1–6 layer flex constructions | 0.20 mm |
| Minimum CNC-Drilled Hole | 8-layer flex construction | 0.15 mm |
| Finished PTH Tolerance | Plated-through holes | ±0.038 mm |
| Protective Films | Coverlay options | PI and PET film |
| Coverlay Registration | Alignment tolerance | 0.10 mm |
| Local Reinforcement | Stiffener-supported construction | PI / FR-4 reinforcement |
| Surface Finish Options | Specified pad and contact finish | OSP, HASL, ENIG, flash gold and tin finishes |
| Controlled Impedance | Impedance-control capability | ±10% |
| Profile Tolerance | Outline / contour | ±0.05 mm |
Define the Complete Flex Construction
Materials, Coverlay and Stiffeners
A flex circuit is more than its copper layers. Define the base film, bonding system, protective layers and local reinforcement together with the contact and installation requirements.
Base Film & Copper
Polyimide forms the flexible dielectric in our primary laminate systems. Define the film, copper type and conductor thickness as part of the stackup, with the intended mechanical use clearly identified.
Material grade, base-film thickness, copper type and copper thickness by layer.
Adhesive Systems
Adhesive-based and adhesiveless laminates describe the copper-to-film construction. Coverlay bonding, multilayer bonding and stiffener attachment are separate interfaces within the finished build.
Laminate construction, bonding layers, adhesive thicknesses and attachment requirements.
Coverlay & Openings
Coverlay insulates and protects the circuit while leaving designated pads and contacts accessible. Define its material, openings and alignment together with the circuit features.
Film and adhesive thicknesses, opening data, exposed-pad areas and registration requirements.
Stiffeners & Support Areas
Local reinforcement supports connector areas, contact tails and component-bearing regions. PI and FR-4 stiffeners provide different forms of thickness control and mechanical support.
Stiffener material, outline, side, thickness, bonding method and alignment features.
Contacts & ZIF Tails
Connector interfaces need more than a pad pattern. Define the exposed contact side, finished insertion thickness and local reinforcement against the selected connector drawing.
Contact pitch, exposed length, tail dimensions, insertion thickness and connector reference.
Surface Finish
Specify the finish for exposed soldering pads and connection contacts. Define finish type, coverage and thickness requirements separately from the copper conductor thickness.
Finish type, pad or contact locations, selective-finish areas and coating thicknesses.
Submit the construction details alongside the fabrication data, drill files and dimensioned drawing.
Manufacturing File Requirements →Define How the Circuit Will Be Used
Static Installation and Dynamic Flexing
A flex circuit bent into position and a circuit that moves repeatedly have different mechanical demands. Describe the use condition alongside the stackup, copper and flexible-region geometry.
Static Flex Installation
The circuit is bent or formed during installation and remains in its installed position during normal operation. Define the final geometry and how the circuit reaches that position.
Example: an internal flex interconnect routed around an enclosure feature and secured in place.
Dynamic Flexing
The circuit bends repeatedly as part of the product’s operation. Define the motion path, bend geometry and expected operating cycles together with the local circuit construction.
Example: a flex interconnect between fixed electronics and a repeatedly moving mechanism.
Swipe horizontally to compare installation and movement requirements.
| Requirement | Static Installation | Dynamic Flexing |
|---|---|---|
| Movement Condition | Installation bending, forming and any later service or maintenance movement. | Repeated operational motion, including its path, direction and repetition. |
| Bend Geometry | Installed radius, angle, available space and the installation sequence. | Radius throughout the motion, travel, angle and the locations of repeated bending. |
| Circuit Construction | Local copper layers, film, adhesive, coverlay and thickness in the formed region. | Local layer arrangement, copper type, thickness and conductor layout in the moving span. |
| Support & Transitions | Fixing points, connector positions, stiffeners and enclosure interfaces. | Moving and fixed attachment points, strain-relief features and transition boundaries. |
| Evaluation Requirements | Installation-fit checks and any specified forming or service-cycle evaluation. | Defined motion test, cycle count, environment and electrical acceptance criteria. |
Select the circuit structure and material construction with the bend-region requirements in view.
Review Flex Circuit Constructions →Development Builds to Repeat Manufacturing
Flex PCB Prototypes and Production
PCBELEC manufactures flexible bare circuits for prototype evaluation, pilot builds and production. Carry the selected stackup, materials and mechanical features into each released manufacturing order.
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01 / ENGINEERING EVALUATION
Flex PCB Prototypes
Manufacture initial and revised flex circuits for your engineering evaluation. Define the substrate, copper, coverlay, stiffeners and connection features for each development build.
- Single-sided, double-sided and multilayer flex
- Specified stackup and flexible-region geometry
- Prototype quantities and project requirements
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02 / PILOT & SMALL-BATCH BUILDS
Low-Volume Flex Orders
Order flexible circuits for pilot runs, early production and ongoing small-batch needs. Define the released revision, delivery format and records for the next project stage.
- Pilot runs and small production batches
- Board, array and handling requirements
- Inspection and documentation details
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03 / RELEASED DESIGNS
Production & Repeat Orders
Manufacture released flex designs for production quantities and repeat builds, with the specified construction and interface details connected to each order.
- Released board revisions and material definitions
- Consistent coverlay and reinforcement details
- Quantity, packaging and delivery planning
Preparing a new order or repeat build? Send the required revision, construction and quantity.
Request a Flex PCB Quote →Fabrication, Verification & Documentation
Manufacturing Quality and Inspection Records
PCBELEC connects material preparation, circuit fabrication, protective layers and final verification in one manufacturing workflow. Inspection focuses on the electrical and mechanical features defined for your flex circuit.
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01 / MATERIALS & BUILD DATA
Prepare the Construction
Review the released files and prepare the specified laminate, copper, stackup and construction data for manufacture.
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02 / CIRCUIT FABRICATION
Form Circuits & Interconnects
Produce the circuit patterns and the drilling, metallization and lamination features required by the selected layer structure.
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03 / PROTECTION & INTERFACES
Add Coverlay, Finish & Support
Form coverlay openings, apply the specified surface finish and add local reinforcement and mechanical features.
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04 / FINISHED CIRCUITS
Verify, Record & Package
Complete the required inspection and testing, prepare the order records and package the finished flexible circuits.
Checks Connected to Your Flex Circuit Features
Circuit Patterns & Electrical Connections
Optical inspection examines manufactured circuit features. Electrical testing checks continuity and isolation; specified impedance structures receive the required verification.
Coverlay & Exposed Contacts
Examine coverlay openings and alignment, exposed pad areas, contact features and visible surface-finish condition.
Dimensions & Reinforcement
Check the profile, holes, connection geometry, stiffener position and specified local thicknesses against the manufacturing drawing.
Cross-Sections & Internal Features
Microsection inspection examines relevant plating, interconnect and layer-interface features within the manufactured construction.
Include critical measurements, acceptance criteria and requested records with your fabrication package.
Explore PCB Testing & Inspection →Custom Flex Circuit Quotation
Request a Flexible PCB Quote
Send your flex circuit files, construction details and quantity to PCBELEC. Include the coverlay, reinforcement, connection and bend-region requirements with the electrical data.
What Shapes the Fabrication Price?
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01
Circuit size, quantity, outline complexity and manufacturing panel utilization.
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02
Layer count, laminate system, copper, dielectric and bonding-layer construction.
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03
Coverlay openings, stiffeners, local thickness requirements and attachment features.
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04
Interconnects, surface finish, contact geometry, impedance and special processing.
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05
Inspection records, delivery format, packaging, destination and required schedule.
Include These Details with Your Inquiry
Manufacturing File Requirements →Files & Board Revision
Fabrication data, drill files, profile, dimensioned drawings and the required revision.
Stackup, Materials & Copper
Layer sequence, laminate grades, copper, dielectric and adhesive thicknesses.
Coverlay & Stiffeners
Opening data, stiffener materials, locations, attachment sides and finished local thicknesses.
Contacts & Mechanical Interfaces
Contact finish, connector geometry, insertion thickness, holes and critical tolerances.
Bend Conditions & Verification
Flexible-region boundaries, static or dynamic use, bend geometry and required evaluation records.
Quantity & Delivery
Order quantity, board or array format, packaging, destination and required date.
Flex Circuit Questions
Flexible PCB Manufacturing FAQ
Practical answers about circuit structures, materials, reinforcement, bending requirements and manufacturing inquiries.
Discuss your next flexible circuit:
sales@pcbelec.comWhat is the difference between a flex PCB and an FPC?
Flex PCB, flexible PCB and FPC are commonly used names for flexible printed circuits. They describe circuitry built on a flexible dielectric rather than a conventional rigid board substrate.
The name alone does not define the layer count, materials, coverlay or reinforcement. See the flexible circuit overview for the main construction features.
Which flex circuit construction should I choose?
Select the construction around the routing, connection and mechanical requirements. Single-layer flex has one conductive layer, double-sided flex has two, and multilayer flex adds further conductive layers.
Use rigid-flex when the design calls for integrated rigid circuit sections and flexible interconnections. Compare the flex circuit constructions and their dedicated manufacturing services.
Is a flex PCB with an FR-4 stiffener the same as rigid-flex?
No. An FR-4 stiffener provides local mechanical support to a flexible circuit. By itself, it does not introduce routed rigid circuit layers. A rigid-flex board integrates rigid circuit sections and flexible regions in one construction.
Explore flex PCB stiffeners or our rigid-flex PCB manufacturing service.
What is the difference between static and dynamic flexing?
In a static installation, the circuit is bent into position and remains there during normal operation. Dynamic flexing involves repeated bending as part of the product’s operation.
These conditions place different demands on the local construction and geometry. Review static installation and dynamic flexing when defining the flexible regions.
What information is needed to define a bend region?
Identify the bend location, direction, radius, angle and installation or motion sequence. Show the local stackup, stiffener boundaries, attachment points and nearby connection areas.
For repeated motion, include the travel, expected cycles, operating environment and evaluation requirements. Put these details in the mechanical drawing alongside the electrical fabrication data.
Which materials and surface finishes can I specify?
Our primary flexible laminate systems include DuPont PI and Shengyi PI. Specify the copper, bonding layers, coverlay and reinforcement with the required pad and contact finish.
See materials, coverlay and stiffeners for construction guidance, and our detailed flex fabrication capabilities for available finish and process specifications.
Do you support flex PCB prototypes and production orders?
Yes. PCBELEC manufactures flexible bare circuits for prototype evaluation, pilot builds, low-volume orders and production. Each order identifies the required revision, construction, quantity and delivery requirements.
Explore our prototype and production services , including the dedicated flex PCB prototyping service.
What affects the cost of a flexible PCB?
Cost reflects the circuit dimensions, quantity, layer structure, materials, copper, coverlay, interconnects and reinforcement. Contact geometry, finish, special processing and panel utilization also shape the quotation.
Include inspection, packaging and schedule requirements when you request a flexible PCB quote .
Which files should I send for a flex PCB quotation?
Send the fabrication data, drill files, dimensioned drawing and required revision. Include the stackup, materials, copper, coverlay openings, stiffeners, contact details and finished thicknesses.
Add bend-region requirements, quantity, delivery format and requested date. Review the manufacturing file requirements before submitting your package.