Custom Flex Circuit Fabrication in China

Flexible PCB Manufacturing

Custom single-layer, double-sided and multilayer flexible PCBs for prototype and production orders. PCBELEC manufactures flex circuits with specified materials, coverlay, stiffeners and connection features for your product’s installation and movement requirements.

Send your fabrication package to sales@pcbelec.com

  • Circuit Structures Single, Double & Multilayer
  • Fabrication Features Coverlay, Stiffeners & Contacts
  • Order Stages Prototypes to Production

Flexible Printed Circuits / FPC

Flexible Circuits Built for Your Product

A flexible PCB, also called a flex circuit or FPC, uses copper circuitry on a thin flexible dielectric, commonly polyimide. It provides electrical connections within a structure that can be shaped around the product’s mechanical layout.

PCBELEC manufactures flexible bare boards with defined circuit layers, coverlay openings, stiffeners and contact features. Specify the flexible regions and connection interfaces alongside the electrical design.

Start with the use condition: a circuit bent into position during installation and a circuit that moves repeatedly in operation have different mechanical demands.

Define the Functional Regions

Flexible circuit regions to define for manufacturing A schematic top view of a flexible circuit. It identifies an exposed contact area at the left, a flexible span in the center and a locally supported connection area at the right. It is not a product photograph. Contact area Flexible span Local support Define coverlay, stiffeners and connection geometry. Schematic top view — not to scale
Functional regions help define the manufacturing package. Exposed contacts, flexible spans and supported connection areas serve different roles.
  • Fit the Installation

    Identify the installed shape, available space, connection positions and the regions that bend during installation.

  • Define the Movement

    For moving circuits, describe the bend location, radius, motion and expected operating cycles in the project requirements.

  • Support the Interfaces

    Define local stiffeners, contact thicknesses, coverlay openings and attachment areas for the specified interfaces.

Select the Circuit Structure

Choose Your Flex Circuit Construction

Start with the routing, connection and movement requirements. Single-layer, double-sided and multilayer flex circuits offer different ways to organize the copper and interconnections.

One Conductive Layer

Copper shown in brown; dielectric in amber.

Single-Layer Flex PCB

One copper circuit layer on a flexible dielectric. A direct construction for interconnects whose routing fits on one conductive layer.

  • One conductive routing layer
  • Defined coverlay and contact openings
  • Local stiffeners at specified interfaces

Two Conductive Layers

Schematic layers; plated interconnections omitted.

Double-Sided Flex PCB

Copper circuits on both sides of a flexible dielectric, with plated-through connections between designated top and bottom features.

  • Top and bottom circuit routing
  • Plated-through layer connections
  • Coverlay and contact features on both sides

Three or More Conductive Layers

Four-layer example; not a complete build drawing.

Multilayer Flex PCB

Three or more conductive layers in a laminated flexible construction, providing additional routing and reference-layer options.

  • Defined layer stackup and interconnections
  • Additional signal or reference layers
  • Region-specific construction and thickness

Flexible Circuit Fabrication Specifications

Flexible PCB Manufacturing Capabilities

PCBELEC manufactures single-sided, double-sided and multilayer flex circuits with polyimide materials, defined routing and interconnects, coverlay protection and local reinforcement.

  • Circuit Layers 1–16 Layers
  • Base Materials DuPont PI / Shengyi PI
  • Maximum Single-Sided Size 480 × 4000 mm

Swipe horizontally to view all fabrication specifications.

Selected flexible PCB manufacturing capabilities by construction and process category
Capability ItemConstruction / CategoryManufacturing Specification
Circuit LayersSingle-sided, double-sided and multilayer flex1–16 layers
Base MaterialsPolyimide laminate systemsDuPont PI / Shengyi PI
Maximum Board SizeSingle-sided flex480 × 4000 mm
Maximum Board SizeDouble-sided flex480 × 1800 mm
Maximum Board SizeMultilayer flex236 × 600 mm
Minimum Board ThicknessSingle-sided flex0.05 mm ±0.02 mm
Minimum Board ThicknessDouble-sided flex0.08 mm ±0.02 mm
Finished Board Thickness1–6 layer flex constructions0.05–0.6 mm
Minimum Trace / Space1/3 oz or 1/2 oz copper; 1–6 layers0.076 / 0.076 mm
Minimum Trace / Space1 oz copper; 1–6 layers0.10 / 0.10 mm
Minimum CNC-Drilled Hole1–6 layer flex constructions0.20 mm
Minimum CNC-Drilled Hole8-layer flex construction0.15 mm
Finished PTH TolerancePlated-through holes±0.038 mm
Protective FilmsCoverlay optionsPI and PET film
Coverlay RegistrationAlignment tolerance0.10 mm
Local ReinforcementStiffener-supported constructionPI / FR-4 reinforcement
Surface Finish OptionsSpecified pad and contact finishOSP, HASL, ENIG, flash gold and tin finishes
Controlled ImpedanceImpedance-control capability±10%
Profile ToleranceOutline / contour±0.05 mm

Define the Complete Flex Construction

Materials, Coverlay and Stiffeners

A flex circuit is more than its copper layers. Define the base film, bonding system, protective layers and local reinforcement together with the contact and installation requirements.

01 / SUBSTRATE & CONDUCTOR

Base Film & Copper

Polyimide forms the flexible dielectric in our primary laminate systems. Define the film, copper type and conductor thickness as part of the stackup, with the intended mechanical use clearly identified.

Include in the Specification

Material grade, base-film thickness, copper type and copper thickness by layer.

02 / LAMINATE & BONDING

Adhesive Systems

Adhesive-based and adhesiveless laminates describe the copper-to-film construction. Coverlay bonding, multilayer bonding and stiffener attachment are separate interfaces within the finished build.

Include in the Specification

Laminate construction, bonding layers, adhesive thicknesses and attachment requirements.

03 / CIRCUIT PROTECTION

Coverlay & Openings

Coverlay insulates and protects the circuit while leaving designated pads and contacts accessible. Define its material, openings and alignment together with the circuit features.

Include in the Specification

Film and adhesive thicknesses, opening data, exposed-pad areas and registration requirements.

04 / LOCAL REINFORCEMENT

Stiffeners & Support Areas

Local reinforcement supports connector areas, contact tails and component-bearing regions. PI and FR-4 stiffeners provide different forms of thickness control and mechanical support.

Include in the Specification

Stiffener material, outline, side, thickness, bonding method and alignment features.

05 / CONNECTION INTERFACES

Contacts & ZIF Tails

Connector interfaces need more than a pad pattern. Define the exposed contact side, finished insertion thickness and local reinforcement against the selected connector drawing.

Include in the Specification

Contact pitch, exposed length, tail dimensions, insertion thickness and connector reference.

06 / EXPOSED COPPER

Surface Finish

Specify the finish for exposed soldering pads and connection contacts. Define finish type, coverage and thickness requirements separately from the copper conductor thickness.

Include in the Specification

Finish type, pad or contact locations, selective-finish areas and coating thicknesses.

Define How the Circuit Will Be Used

Static Installation and Dynamic Flexing

A flex circuit bent into position and a circuit that moves repeatedly have different mechanical demands. Describe the use condition alongside the stackup, copper and flexible-region geometry.

Installation & Fixed Position

Static Flex Installation

The circuit is bent or formed during installation and remains in its installed position during normal operation. Define the final geometry and how the circuit reaches that position.

Example: an internal flex interconnect routed around an enclosure feature and secured in place.

Repeated Operational Movement

Dynamic Flexing

The circuit bends repeatedly as part of the product’s operation. Define the motion path, bend geometry and expected operating cycles together with the local circuit construction.

Example: a flex interconnect between fixed electronics and a repeatedly moving mechanism.

Swipe horizontally to compare installation and movement requirements.

Information to define for static installation and dynamic flexible-circuit applications
RequirementStatic InstallationDynamic Flexing
Movement Condition Installation bending, forming and any later service or maintenance movement. Repeated operational motion, including its path, direction and repetition.
Bend Geometry Installed radius, angle, available space and the installation sequence. Radius throughout the motion, travel, angle and the locations of repeated bending.
Circuit Construction Local copper layers, film, adhesive, coverlay and thickness in the formed region. Local layer arrangement, copper type, thickness and conductor layout in the moving span.
Support & Transitions Fixing points, connector positions, stiffeners and enclosure interfaces. Moving and fixed attachment points, strain-relief features and transition boundaries.
Evaluation Requirements Installation-fit checks and any specified forming or service-cycle evaluation. Defined motion test, cycle count, environment and electrical acceptance criteria.

Development Builds to Repeat Manufacturing

Flex PCB Prototypes and Production

PCBELEC manufactures flexible bare circuits for prototype evaluation, pilot builds and production. Carry the selected stackup, materials and mechanical features into each released manufacturing order.

  • 01 / ENGINEERING EVALUATION

    Flex PCB Prototypes

    Manufacture initial and revised flex circuits for your engineering evaluation. Define the substrate, copper, coverlay, stiffeners and connection features for each development build.

    • Single-sided, double-sided and multilayer flex
    • Specified stackup and flexible-region geometry
    • Prototype quantities and project requirements
  • 02 / PILOT & SMALL-BATCH BUILDS

    Low-Volume Flex Orders

    Order flexible circuits for pilot runs, early production and ongoing small-batch needs. Define the released revision, delivery format and records for the next project stage.

    • Pilot runs and small production batches
    • Board, array and handling requirements
    • Inspection and documentation details
  • 03 / RELEASED DESIGNS

    Production & Repeat Orders

    Manufacture released flex designs for production quantities and repeat builds, with the specified construction and interface details connected to each order.

    • Released board revisions and material definitions
    • Consistent coverlay and reinforcement details
    • Quantity, packaging and delivery planning

Fabrication, Verification & Documentation

Manufacturing Quality and Inspection Records

PCBELEC connects material preparation, circuit fabrication, protective layers and final verification in one manufacturing workflow. Inspection focuses on the electrical and mechanical features defined for your flex circuit.

  1. 01 / MATERIALS & BUILD DATA

    Prepare the Construction

    Review the released files and prepare the specified laminate, copper, stackup and construction data for manufacture.

  2. 02 / CIRCUIT FABRICATION

    Form Circuits & Interconnects

    Produce the circuit patterns and the drilling, metallization and lamination features required by the selected layer structure.

  3. 03 / PROTECTION & INTERFACES

    Add Coverlay, Finish & Support

    Form coverlay openings, apply the specified surface finish and add local reinforcement and mechanical features.

  4. 04 / FINISHED CIRCUITS

    Verify, Record & Package

    Complete the required inspection and testing, prepare the order records and package the finished flexible circuits.

Checks Connected to Your Flex Circuit Features

  • Circuit Patterns & Electrical Connections

    Optical inspection examines manufactured circuit features. Electrical testing checks continuity and isolation; specified impedance structures receive the required verification.

  • Coverlay & Exposed Contacts

    Examine coverlay openings and alignment, exposed pad areas, contact features and visible surface-finish condition.

  • Dimensions & Reinforcement

    Check the profile, holes, connection geometry, stiffener position and specified local thicknesses against the manufacturing drawing.

  • Cross-Sections & Internal Features

    Microsection inspection examines relevant plating, interconnect and layer-interface features within the manufactured construction.

Custom Flex Circuit Quotation

Request a Flexible PCB Quote

Send your flex circuit files, construction details and quantity to PCBELEC. Include the coverlay, reinforcement, connection and bend-region requirements with the electrical data.

What Shapes the Fabrication Price?

  1. Circuit size, quantity, outline complexity and manufacturing panel utilization.

  2. Layer count, laminate system, copper, dielectric and bonding-layer construction.

  3. Coverlay openings, stiffeners, local thickness requirements and attachment features.

  4. Interconnects, surface finish, contact geometry, impedance and special processing.

  5. Inspection records, delivery format, packaging, destination and required schedule.

Include These Details with Your Inquiry

Manufacturing File Requirements
  • Files & Board Revision

    Fabrication data, drill files, profile, dimensioned drawings and the required revision.

  • Stackup, Materials & Copper

    Layer sequence, laminate grades, copper, dielectric and adhesive thicknesses.

  • Coverlay & Stiffeners

    Opening data, stiffener materials, locations, attachment sides and finished local thicknesses.

  • Contacts & Mechanical Interfaces

    Contact finish, connector geometry, insertion thickness, holes and critical tolerances.

  • Bend Conditions & Verification

    Flexible-region boundaries, static or dynamic use, bend geometry and required evaluation records.

  • Quantity & Delivery

    Order quantity, board or array format, packaging, destination and required date.

Flex Circuit Questions

Flexible PCB Manufacturing FAQ

Practical answers about circuit structures, materials, reinforcement, bending requirements and manufacturing inquiries.

Discuss your next flexible circuit:

sales@pcbelec.com
What is the difference between a flex PCB and an FPC?

Flex PCB, flexible PCB and FPC are commonly used names for flexible printed circuits. They describe circuitry built on a flexible dielectric rather than a conventional rigid board substrate.

The name alone does not define the layer count, materials, coverlay or reinforcement. See the flexible circuit overview for the main construction features.

Which flex circuit construction should I choose?

Select the construction around the routing, connection and mechanical requirements. Single-layer flex has one conductive layer, double-sided flex has two, and multilayer flex adds further conductive layers.

Use rigid-flex when the design calls for integrated rigid circuit sections and flexible interconnections. Compare the flex circuit constructions and their dedicated manufacturing services.

Is a flex PCB with an FR-4 stiffener the same as rigid-flex?

No. An FR-4 stiffener provides local mechanical support to a flexible circuit. By itself, it does not introduce routed rigid circuit layers. A rigid-flex board integrates rigid circuit sections and flexible regions in one construction.

Explore flex PCB stiffeners or our rigid-flex PCB manufacturing service.

What is the difference between static and dynamic flexing?

In a static installation, the circuit is bent into position and remains there during normal operation. Dynamic flexing involves repeated bending as part of the product’s operation.

These conditions place different demands on the local construction and geometry. Review static installation and dynamic flexing when defining the flexible regions.

What information is needed to define a bend region?

Identify the bend location, direction, radius, angle and installation or motion sequence. Show the local stackup, stiffener boundaries, attachment points and nearby connection areas.

For repeated motion, include the travel, expected cycles, operating environment and evaluation requirements. Put these details in the mechanical drawing alongside the electrical fabrication data.

Which materials and surface finishes can I specify?

Our primary flexible laminate systems include DuPont PI and Shengyi PI. Specify the copper, bonding layers, coverlay and reinforcement with the required pad and contact finish.

See materials, coverlay and stiffeners for construction guidance, and our detailed flex fabrication capabilities for available finish and process specifications.

Do you support flex PCB prototypes and production orders?

Yes. PCBELEC manufactures flexible bare circuits for prototype evaluation, pilot builds, low-volume orders and production. Each order identifies the required revision, construction, quantity and delivery requirements.

Explore our prototype and production services , including the dedicated flex PCB prototyping service.

What affects the cost of a flexible PCB?

Cost reflects the circuit dimensions, quantity, layer structure, materials, copper, coverlay, interconnects and reinforcement. Contact geometry, finish, special processing and panel utilization also shape the quotation.

Include inspection, packaging and schedule requirements when you request a flexible PCB quote .

Which files should I send for a flex PCB quotation?

Send the fabrication data, drill files, dimensioned drawing and required revision. Include the stackup, materials, copper, coverlay openings, stiffeners, contact details and finished thicknesses.

Add bend-region requirements, quantity, delivery format and requested date. Review the manufacturing file requirements before submitting your package.

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