Through hole PCB assembly is still essential for many electronics that require strong mechanical bonding, high reliability, and durable performance. This guide compares through hole assembly with SMT so you can choose the right process for your application.
Through Hole PCB Assembly vs. SMT: Which PCB Assembly Method Is Right for You? Read More »
For lead-free through-hole assembly, wave soldering still excels in high-volume, wave-friendly designs, while selective soldering shines on dense, mixed-technology boards that demand precise, localized heat and low defect rates. This article explains how both processes work, their strengths and limitations, and when each is the better fit.
Wave Soldering vs. Selective Soldering in Lead-Free Through-Hole Assembly Read More »
Lead-free PCB assembly brings unique manufacturing challenges, from solder bridging and tombstoning to voids and insufficient wetting. This article explains the most common defects and practical ways to prevent them.
Common Defects in Lead-Free PCB Assembly and How to Prevent Them Read More »
This FAQ-style guide answers the most common questions engineers and OEMs ask about lead-free and RoHS-compliant PCB assembly. It covers what “lead-free” and RoHS actually mean, how they affect solder choice, laminates, finishes, design rules, reliability, and test, plus what documentation and supplier practices you should expect when building RoHS-compliant boards.
Frequently Asked Questions About Lead-Free and RoHS-Compliant PCB Assembly Read More »
This article explains how to combine lead-free SMT and through-hole assembly on a single mixed-technology PCB. It covers process flow (lead-free reflow, wave, and selective soldering), design rules for pad and hole layout, thermal and fixturing considerations, and how to avoid common defects when SMT and THT share the same board. It is written for design and manufacturing teams building RoHS-compliant mixed assemblies.
Mixed Technology PCB Assembly: Combining Lead-Free SMT and Through-Hole on One Board Read More »
This article unpacks the cost and lifecycle implications of switching from traditional leaded to lead-free PCB assembly. It explains where costs really change—materials, equipment, process validation, defects—and how those changes play out over a product’s lifetime in terms of reliability, obsolescence, RoHS compliance, and supply-chain risk. It is written for engineers and sourcing teams planning a transition to lead-free manufacturing.
Cost and Lifecycle Considerations When Switching to Lead-Free PCB Assembly Read More »
This article explains how lead-free reflow soldering profiles differ from traditional tin‑lead processes, from higher peak temperatures and tighter process windows to changes in wetting behavior, reliability, and oven setup. It is written for engineers and manufacturing teams tuning profiles for modern RoHS‑compliant assemblies.
Lead-Free Reflow Soldering Profiles: How They Differ from Traditional Processes Read More »
This guide explains what designers and OEMs should look for when selecting a lead-free PCB assembly partner for RoHS projects, including technical capabilities, compliance practices, documentation, and the questions to ask during supplier evaluation.
Choosing a Lead-Free PCB Assembly Partner for RoHS Projects Read More »
This article compares lead and lead-free solder in PCB assembly, covering differences in melting point, reliability, cost, manufacturability, and practical application choices for designers and OEMs.
This article explains the practical requirements behind RoHS-compliant PCB assembly, from restricted substances and material selection to component sourcing, process changes, and documentation that designers and OEMs should plan for.
RoHS-Compliant PCB Assembly: Key Requirements for Designers and OEMs Read More »
