Rigid-flex PCB stackup combines rigid and flexible layers for compact, reliable designs. Explore its types, design tips, and applications in this guide.
Rigid-Flex PCB Stackup: Design and Manufacturing Guide Read More »
PCB Stack-up refers to the arrangement of copper layers and insulating layers that make up a PCB prior to board layout design. PCB stack up is am important part of the PCB design and manufacturing process.
Guide to Multilayer PCB Layer Stackup and thickness Read More »
As a professional PCB manufacturer, we have summarized the following PCB stacking design guidelines and precautions in practical applications, hoping to be helpful to most PCB designers.
PCB Stackup Design Guidelines: Best Practices for 2, 4, 6 Layers Read More »
PCB design is a complete and rigorous process system, and PCB manufacturing is another set of sophisticated production and processing systems.
A Free Software for PCB Design for Manufacturing or DFM Analysis Read More »
HDI circuit board is an advanced printed circuit board. If you suspect you’ll need to work with component densities that require HDI layout and routing, here’s what you need to know about your next board and how to plan your design.
Printed circuit boards have become a fundamental factor in developing contemporary electronic products. Printed circuit boards are one of the core components of electronic products. According to different end products and usage scenarios, the PCB production process’s limitations and the PCB circuit boards’ design should also follow specific rules.
This guide provides 10 actionable tips for optimizing PCB designs for manufacturability, covering component selection, assembly methods, layout best practices, and key design specifications. Follow these strategies to reduce costs, enhance production efficiency, and achieve high-quality PCBs with JHYPCB.
10 Essential Tips for Optimizing PCB Design for Manufacturing Read More »
Learn PCB DFM and DFA best practices to streamline manufacturing and assembly. This guide covers key design tips, common mistakes, and practical solutions for high-quality PCBs.
PCB DFM and DFA: Best Practices for Optimal Design Read More »
Impedance control is critical for high-performance FPC PCBs in 5G, IoT, and automotive applications. Learn five key factors—substrate properties, trace design, spacing, etching, and plating—to ensure signal integrity. Partner with JHYPCB for expert FPC solutions. Read more to optimize your designs!
5 Key Factors for FPC PCB Impedance Control Success Read More »
