Lead-Free PCB Assembly

mixed technology pcb assembly with lead free smt and through hole

Mixed Technology PCB Assembly: Combining Lead-Free SMT and Through-Hole on One Board

PCBA Insights / By

This article explains how to combine lead-free SMT and through-hole assembly on a single mixed-technology PCB. It covers process flow (lead-free reflow, wave, and selective soldering), design rules for pad and hole layout, thermal and fixturing considerations, and how to avoid common defects when SMT and THT share the same board. It is written for design and manufacturing teams building RoHS-compliant mixed assemblies.

Mixed Technology PCB Assembly: Combining Lead-Free SMT and Through-Hole on One Board Read More »

cost and lifecycle considerations when switching to lead free pcb assembly

Cost and Lifecycle Considerations When Switching to Lead-Free PCB Assembly

PCB Cost and Budgeting / By

This article unpacks the cost and lifecycle implications of switching from traditional leaded to lead-free PCB assembly. It explains where costs really change—materials, equipment, process validation, defects—and how those changes play out over a product’s lifetime in terms of reliability, obsolescence, RoHS compliance, and supply-chain risk. It is written for engineers and sourcing teams planning a transition to lead-free manufacturing.

Cost and Lifecycle Considerations When Switching to Lead-Free PCB Assembly Read More »

lead free reflow soldering profiles vs traditional processes

Lead-Free Reflow Soldering Profiles: How They Differ from Traditional Processes

PCBA Insights / By

This article explains how lead-free reflow soldering profiles differ from traditional tin‑lead processes, from higher peak temperatures and tighter process windows to changes in wetting behavior, reliability, and oven setup. It is written for engineers and manufacturing teams tuning profiles for modern RoHS‑compliant assemblies.

Lead-Free Reflow Soldering Profiles: How They Differ from Traditional Processes Read More »

Scroll to Top